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Wafer Flatness

Wafer Flatness, Bow, Warp, TTV Mapping System

Non-Contact Wafer Flatness, Thickness, Bow and Warp Measurement System

FLA-200

Description

  • Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)

  • Measures all materials including Si, GaAs, Ge, InP, SiC

  • Full 500 micron thickness measurement range without re-calibration

  • 2-D /3-D Mapping software

 

Applications

  • Semiconductor materials, Solar-cell materials (Silicon, Polysilicon, SiC etc)

  • Silicon-related epitaxial materials, Ion-implantation sample

  • Chemical compound semiconductor (GaAs Epi, GaN Epi, InP, Ga etc)

  • Rigid hard materials

 

Sample sizes:

  • 3 ~ 8 inch


Measuring range

  • Thickness: 200 –1200μm

  • Bow : +/-350μm

  • Warp: 350μm

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Wafer flatness measurement system

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