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Stein Labs
Stein Labs, LLC is your North American Connection for Napson Corporation

Wafer Flatness
Wafer Flatness, Bow, Warp, TTV Mapping System

FLA-200
Description
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Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)
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Measures all materials including Si, GaAs, Ge, InP, SiC
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Full 500 micron thickness measurement range without re-calibration
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2-D /3-D Mapping software
Applications
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Semiconductor materials, Solar-cell materials (Silicon, Polysilicon, SiC etc)
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Silicon-related epitaxial materials, Ion-implantation sample
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Chemical compound semiconductor (GaAs Epi, GaN Epi, InP, Ga etc)
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Rigid hard materials
Sample sizes:
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3 ~ 8 inch
Measuring range
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Thickness: 200 –1200μm
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Bow : +/-350μm
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Warp: 350μm
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Wafer flatness measurement system
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