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Wafer Mapping - Non Contact

Multi-Point Mapping System for measuring Sheet Resistance and Resistivity

Non contact wafer mapping prenets damage

NC-80MAP

Description

  • Possible to measure wide range of sheet resistance by installing Max. 4 probes
    Min. 8 mm position from edge can be measured
    User programmable measurement pattern & programmable measuring pattern
    *Option: thickness measurement probe (for silicon wafer)

 

Applications

  • Semiconductor materials, Solar-cell materials (Silicon, Polysilicon, SiC etc)

  • New materials, functional materials (Carbon nanotube, DLC, graphene, Ag nanowire etc)

  • Conductive thin film (Metal, ITO etc)

  • Chemical compound semiconductor (GaAs Epi, GaN Epi, InP, Ga etc)

  • Others (*Please contact us for details)

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  • Silicon-related epitaxial materials, Ion-implantation sample

 

Sample sizes:

  • 2 ~ 8 inch (Option; 12 inch)


Measuring range

  1. [R] 1m ~ 200 Ω・cm
    [RS] 10m ~ 3,000 Ω/sq
    * The range is separated from each Low, Middle, High and S-High probe type.

*Please refer the measurement range for each probe type as below;
(1)Low:0.01~0.5Ω/□(0.001~0.05Ω·cm)
(2)Middle:0.5~10Ω/□(0.05~0.5Ω·cm)
(3)High:10~1000Ω/□(0.5~60Ω·cm)
(4)S-High:1000~3000Ω/□(60~200Ω·cm)

Size

W 780 × D 580 × H 375 mm
Approx. 70 kg

Automated Non-Contact wafer Mapping System

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