FLA-200 Non-Contact Wafer Flatness, Thickness, Bow and Warp Measurement System
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Description
Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)
Measures all materials including Si, GaAs, Ge, InP, SiC
Full 500 micron thickness measurement range without re-calibration
2-D /3-D Mapping software
Applications
Sample sizes 3~8 inch
Measuring range
Thickness: 200 –1200μm
Bow : +/-350μm
Warp: 350μm
Related productWafer flatness sorting system : NC-2000(Robotic carrier), NC-6800(Belt carrier)
*Adding Resisitivity measurement module and/or PN checker module system is also available.
Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)
Measures all materials including Si, GaAs, Ge, InP, SiC
Full 500 micron thickness measurement range without re-calibration
2-D /3-D Mapping software
Applications
- Semiconductor materials, Solar-cell materials (Silicon, Polysilicon, SiC etc)
- Silicon-related epitaxial materials, Ion-implantation sample
- Chemical compound semiconductor (GaAs Epi, GaN Epi, InP, Ga etc)
Sample sizes 3~8 inch
Measuring range
Thickness: 200 –1200μm
Bow : +/-350μm
Warp: 350μm
Related productWafer flatness sorting system : NC-2000(Robotic carrier), NC-6800(Belt carrier)
*Adding Resisitivity measurement module and/or PN checker module system is also available.
