• HOME
  • About
  • Contact Resistivity
  • Non Contact Resistivity
    • Non Contact In Line
  • PN Type Check
  • Flatness/Thickness
  • Life-Time
  • Spreading Resistance
  • Reference Wafers
  • 4 Point Probes
  • Contact Us
  • Technical Principles
Stein Labs, LLC
Search Solutions
Picture
FLA-200  Non-Contact Wafer Flatness, Thickness, Bow and Warp Measurement System
Picture
Picture
Description
Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)
Measures all materials including Si, GaAs, Ge, InP, SiC
Full 500 micron thickness measurement range without re-calibration
2-D /3-D Mapping software
Applications
  • Semiconductor materials, Solar-cell materials (Silicon, Polysilicon, SiC etc)
  • Silicon-related epitaxial materials, Ion-implantation sample
  • Chemical compound semiconductor (GaAs Epi, GaN Epi, InP, Ga etc)

Sample sizes  3~8 inch

Measuring range
​
Thickness: 200 –1200μm
Bow : +/-350μm
Warp: 350μm

Related productWafer flatness sorting system : NC-2000(Robotic carrier), NC-6800(Belt carrier)
 *Adding Resisitivity measurement module and/or PN checker module system is also available.
FLA-200 PDF
Picture
Picture
Picture

HOME   
CONTACT RESISTIVITY
NON-CONTACT RESISTIVITY
FLATNESS/THICKNESS
P/N TYPING
NON-CONTACT IN-LINE
LIFE TIME
SPREADING RESISTANCE
4 POINT PROBE HEADS 
TECHNICAL PRINCIPLES
NRW REFERENCE WAFERS
ABOUT
CONTACT US
© 2022 Stein Labs, LLC. & Napson Corporation  All rights Reserved.  Bedford, MA    PHONE: +1 (508) 591-3686  EMAIL: